President Biden, Governor DeWine and hundreds of other guests gathered at the site of future Intel semiconductor plants to commemorate the start of the largest construction project in the history of Ohio.

On the morning of Sept. 9, hundreds of guests – made up of local, county, state and federal officials, along with building trades, business and education leaders – stood on the ground where Intel’s first fab will be constructed and took part in the groundbreaking ceremony.

Initially scheduled to take place on July 22, the ceremony was postponed to September due to concerns regarding the inability of Congress to pass the Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Act. In late July, Congress passed the CHIPS Act as part of House Resolution 4346, and Biden signed it into law on Aug. 9. A month later, with site work already started, dignitaries gathered to formally celebrate the beginning of the $20 billion project that will build two Intel fabs, an office building and other key infrastructure.  Continue reading →